Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state‑of‑the‑art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

• To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
• Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
• Carry out calibration/ preventive maintenance to the machine and equipment.
• Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
• Performs other project related to improve production operation. Assist process engineer to carry ...