Location
Hsinchu City
Job Type
Full-time
Posted
May 27, 2026
Job Description
Job Description1. Automotive Packaging development, New product introduction, Mass production, Supplier management.
2. Develop and evaluate the advanced IC Package technology.
3. Collaborate with the assembly subcontractors to complete the technology development.
4. Qualification and yield improvement for the advanced IC Packages.
5. Audit subcontractors.Requirement1. MS degree (or above) in Science or Engineering.
2. In depth understanding of IC package cost structure, manufacturing, material, process.
3. Familiar/experienced with advance IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D related packages.
4. Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/InFO.
5. Familiar with TO flow, OSAT management, Automotive quality/reliability requirement.
2. Develop and evaluate the advanced IC Package technology.
3. Collaborate with the assembly subcontractors to complete the technology development.
4. Qualification and yield improvement for the advanced IC Packages.
5. Audit subcontractors.Requirement1. MS degree (or above) in Science or Engineering.
2. In depth understanding of IC package cost structure, manufacturing, material, process.
3. Familiar/experienced with advance IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D related packages.
4. Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/InFO.
5. Familiar with TO flow, OSAT management, Automotive quality/reliability requirement.
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