Engineer, Senior(Technology Integration - Wafer-level Packaging)

Qualcomm · singapore, singapore, Singapore

Location
singapore
Job Type
Full-time
Posted
June 04, 2026

Job Description

Company

Company: RF360 Singapore Pte., Ltd.

Role Overview

Job Area: Engineering Group > Hardware Engineering

Responsible for end‑to‑end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies. Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and technology leadership. Initiate and actively participate in discussions on formulation of process technology innovation and release process improvement. Collaborate and develop effective working relationships with technology partners to accomplish project/task goals within committed schedule. Develop new and impactful ideas, materials, solutions, or procedures for product fabrication process to meet business goals and launch schedule with competitive manufacturing costs. Serve as technology subject matter expert applying technical knowledg...

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