HBM Packaging Engineer for NPI — AI‑Driven Innovation

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore is seeking engineers for the Package Development Engineering Team for Advanced Packaging to support next-generation memory and HBM packaging technologies, transitioning from development to high-volume manufacturing.

You will collaborate with Development, Manufacturing and supplier teams, applying AI tools, DOE methods, and process improvements to accelerate learning and ensure robust tech transfer.