Mechanical & Thermal Analysis Intern - Advanced Packages

AMD is offering an internship in Singapore focused on mechanical and thermal analysis of advanced packaged devices. Interns will gain hands-on experience with analysis techniques, data tools, and collaborate with cross-functional teams. Ideal for students pursuing a Master's or PhD in related engineering fields, the role emphasizes independent work, strong analytical, communication, and presentation skills. Internship lasts from May to December 2026 with potential extension.
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