Location
Hsinchu City
Job Type
Full-time
Posted
May 25, 2026
Job Description
Job Description1. New Product risk assessment on Substrate for 2.5D/3D/CPO advanced package & Board level qualification
2. Substrate electrical & physical analysis for Advanced Package
3. New product reliability concern engagement with customer
4. New assembly SBT supplier audit & qualification
5. Assembly supplier SBT quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)
6. New product/technology introduction quality & reliability management
7. Assembly SBT supplier quality improvement projectRequirement1. MS degree (or above) in Material Science or Engineering.
2. Familiar with Assembly substrate processes.
3. Familiar with problem solving and 8D CAR methodology
4. VQA/IQA or MQR related experience
5. Package Substrate & Board level reliability qualification experience
2. Substrate electrical & physical analysis for Advanced Package
3. New product reliability concern engagement with customer
4. New assembly SBT supplier audit & qualification
5. Assembly supplier SBT quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)
6. New product/technology introduction quality & reliability management
7. Assembly SBT supplier quality improvement projectRequirement1. MS degree (or above) in Material Science or Engineering.
2. Familiar with Assembly substrate processes.
3. Familiar with problem solving and 8D CAR methodology
4. VQA/IQA or MQR related experience
5. Package Substrate & Board level reliability qualification experience
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