Location
méxico
Job Type
Full-time
Posted
June 10, 2026
Job Description
8+ years of experience in flip-chip-BGA package design with high-speed SerDes (BSEE or similar field) or 6+ years of experience with MSEE or similar field.Experience with Cadence APD (Allegro Package Designer) or equivalent tools.Knowledge of package-level signal integrity and power integrity.Self-management and organizational skills.
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