Staff Process Engineer - Dicing, Grinding & Bonding

A semiconductor company in Kulim is seeking a senior engineer specialized in dicing and grinding processes. You will be responsible for optimizing manufacturing processes, leading continuous improvement initiatives, and conducting risk assessments. The ideal candidate will have at least 10 years of experience in manufacturing and 5 years in dicing/grinding/LLO/Bonding process engineering. Proficiency in English and Bahasa Malaysia is required, along with a degree in a relevant engineering field.
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