Location
yishun
Job Type
Full-time
Posted
June 09, 2026
Job Description
Job Description: JD:
Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices. Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing. Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time. Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements Drive capability enhancement and cost reduction projects
JR:
Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Sc...
Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices. Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing. Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time. Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements Drive capability enhancement and cost reduction projects
JR:
Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Sc...