Location
Hsinchu City
Job Type
Full-time
Posted
June 02, 2026
Job Description
Job Description1. Develop 3.5D methodology from RTL to GDS and Package
2. Coordinate Thermal and PI/SI team to deal with high power design
3. Execute the project at different phasesRequirement1. Advance process or package design experience
2. Better to have 3.5D design experience
3. Better to have experiene in large scale and high power design
4. Good communication skill in English
2. Coordinate Thermal and PI/SI team to deal with high power design
3. Execute the project at different phasesRequirement1. Advance process or package design experience
2. Better to have 3.5D design experience
3. Better to have experiene in large scale and high power design
4. Good communication skill in English
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Submit your application for Technology Engineer(3.5D methodology) at MediaTek
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