Thermal Compression Bonding Development Engineer

Job Details:

Job Description:

The Role and Impact:

• Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM‑TD) department, where you’ll play a pivotal role in shaping the future of assembly and packaging technologies.

• In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel’s advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting‑edge semiconductor packages.

• With an emphasis on experimentation, data analysis, and collaboration, you’ll support Intel’s mission to deliver world‑class products that empower global innovation.

• This role provides an opportunity to make a meaningful impact on Intel’s success and growth in the semiconductor industry.

Key Res...