Location
lapu lapu
Job Type
Full-time
Posted
June 03, 2026
Job Description
Job Description
The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.
Reporting Relationship
Reports directly to the FOL Process Engineering Team Lead.
Responsibilities
- Own and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
- Drive yield and quality improvements by troubleshooting wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis tools.
- Develop and maintain...